Advent Solar Inc. (New Mexico, United States) has expanded its Ventura technology manufacturing capability to include all common silicon types, including multi-crystalline, mono-crystalline and UMG. Manufacturers will be able to select the silicon solution that will best address their customers' price and performance needs. With its new capabilities, Advent Solar has achieved high cell efficiencies with its new products. These results have been validated via round robin tests at Fraunhofer, NREL and Sandia Labs.

·         18.2% on mainstream 156 mm mono-silicon wafers

·         17.2% on 156 mm multi-crystalline wafers

·         16.56% on 156 mm UMG wafers

Advent Solar achieved these cell efficiencies milestones by leveraging its Emitter-Wrap Through (EWT) back-contact technology, which is part of the Ventura solar architecture. EWT eliminates grid obstruction, while still using cost effective fabrication processes and solar-grade materials, such as mainstream mono-silicon and UMG wafers.

By Vasil Sidorov on April 21, 2009 after RenewableEnergyWorld.com